Fiches techniques — Catégorie : Photopolymer resins
Standard Resins — Technical Specifications
Matériau
Standard Resin
SUNLU
Color Resin V5
Formlabs
White/Black Resin V5
Formlabs
Physical properties
Density (liquid)
1.05–1.15 g/cm³
≈1.1 g/cm³
≈1.1 g/cm³
Density (solid, post-treated)
1.16–1.21 g/cm³
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Viscosity
100–350 mPa·s @25 °C
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Volumetric shrinkage
7–9%
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Hardness (Shore D)
80–85 D
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Coefficient of thermal expansion
95 × 10⁻⁶ /K
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Mechanical properties
Tensile strength
36 MPa
46 MPa (green) / 54 MPa (post-cure)
46 MPa (green) / 54 MPa (post-cure) / 62 MPa (post-cure 60 °C)
Young's modulus
1280 MPa
2200 MPa (green) / 2500 MPa (after-cure)
2200 MPa (green) / 2500 MPa (after-cure) / 2675 MPa (after-cure 60 °C)
Elongation at break
10%
22% (green) / 15% (post-treatment)
22% (green) / 15% (post-cure) / 13% (post-cure 60°C)
Flexural strength
40 MPa
82 MPa (green) / 91 MPa (post-cure)
82 MPa (green) / 91 MPa (post-cure) / 103 MPa (post-cure 60 °C)
Bending module
1430 MPa
2000 MPa (green) / 2450 MPa (after-cure)
2000 MPa (green) / 2450 MPa (after-cure) / 2750 MPa (after-cure 60 °C)
Impact resistance (Izod)
30 J/m
36 J/m (green) / 34 J/m (after-treatment)
36 J/m (green) / 34 J/m (after-cure) / 32 J/m (after-cure 60 °C)
Thermal properties
Glass transition temperature (Tg)
48 °C
≈50 °C
≈50 °C
Load deflection temperature (HDT)
55 °C @0.45 MPa
47 °C (green) / 54 °C (post-cure) @1.8 MPa; 55 °C (green) / 62 °C (post-cure) @0.45 MPa
47 °C (green) / 54 °C (post-cure) / 59 °C (post-cure 60 °C) @1.8 MPa; 55 °C (green) / 62 °C (post-cure) / 71 °C (60 °C post-cure) @0.45 MPa
Decomposition temperature (5% TGA)
355 °C
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